118 www.nordsonefd.com info@nordsonefd.com USA & Canada 800-556-3484 Europe 00800 7001 7001 Asia +86 (21) 3866 9006 Thermal Compounds Thermal Compounds Non-silicone thermal compounds are used in a wide range of electronic and electromechanical applications because they are resistant to thermal cycling degradation. Thermal compounds are formulated to provide excellent heat transfer. They are non-hazardous, and are RoHS and REACH compliant (lead-free). Their long shelf-life stability ensures that they will not dry, harden, or melt in normal use. For challenging applications, thermal compounds are available with specialty features. Choosing the best thermal compound requires some understanding of the mechanics of heat transfer and how the thickness of the thermal compound layer, the bond line thickness, influences product choice. SPECIFICATIONS Formula 52022 52054 52055* 52050 52160 53053 Specific Gravity at 25 °C 2.7 3.0 2.8 2.6 2.6 2.8 Bleed: 24 Hrs., % Weight 0.1 0.0 0.0 0.01 0.3 0.3 Evaporation: 150C, 24 Hrs., %Weight 0.15 <2.0 1.0 0.6 0.5 0.5 Thermal Conductivity: W/m-K 0.92 1.3 1.3 3.8 2 3.5 Dielectric Strength: V/mil 305 265 265 351 n/a 318 Dielectric Constant: 25 °C, 1000Hz 4.5 5.02 5.02 4.92 n/a 5 Dissipation Factor: 25 °C, 1000Hz 0.0029 0.0022 0.0022 0.0032 n/a 0.0027 Volume Resistivity: Ohm-cm 1.65x10^14 2.0x10^15 2.0x10^15 1.0x10^13 over current 2.15x10^15 Operating Temperature: °C -40 to 200 -40 to 180 0 to 180 -40 to 200 -40 to 200 -40 to 200 Flow Rate: g/min 4 to 7 8 to 9 4.5 to 6.5 1 to 3 3 to 8 7 to 9 Minimum Bond Line: mm 0.0381 0.0127 0.0127 0.0508 0.0254 0.1270 Viscosity: 25 °C kCps 460 470 620 350 230 1000 Viscosity: 50 °C kCps 400 410 550 60 170 400 Appearance Smooth, off-white paste Smooth white paste Smooth white paste Dark gray paste Smooth, gray paste Off white paste Shelf Life 1 year 1 year 1 year 1 year 1 year 1 year *Water cleanable for easy clean up www.nordsonefd.com/TIM
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