116 www.nordsonefd.com info@nordsonefd.com USA & Canada 800-556-3484 Europe 00800 7001 7001 Asia +86 (21) 3866 9006 Solder Formulations Solder Formulations There are many possible options when formulating a solder paste. Nordson EFD’s general purpose solder pastes will meet most application requirements. For special requirements, EFD offers a range of specialized formulations. Please contact your Nordson EFD solder sales specialist for a free consultation. LEADED ALLOYS Alloy Solidus (°C) Liquidus (°C) Sn43 Pb43 Bi14 144 163 Sn62 Pb36 Ag2 179 189 Sn63 Pb37 183E* Sn60 Pb40 183 191 Sn10 Pb88 Ag2 268 290 Sn10 Pb90 275 302 Sn5 Pb92.5 Ag2.5 287 296 Sn5 Pb95 308 312 POWDER SIZE Powder Type Powder Size (micron) Gullwing Lead Pitch (mm/in) Square / Circle Aperture (mm/in) Dispense Dot Dia. (mm/in) General Purpose Tip Gauge Tapered Tip Gauge II 45−75 μ 0.65 / 0.025 0.65 / 0.025 0.80 / 0.030 21 22 III 25−45 μ 0.50 / 0.020 0.50 / 0.020 0.50 / 0.020 22 25 IV 20−38 μ 0.30 / 0.012 0.30 / 0.012 0.30 / 0.012 25 27 V 15−25 μ 0.20 / 0.008 0.15 / 0.006 0.25 / 0.010 27 – VI 5−15 μ 0.10 / 0.004 0.05 / 0.002 0.15 / 0.006 32 – LEAD-FREE ALLOYS Alloy Solidus (°C) Liquidus (°C) Sn42 Bi57 Ag1.0 137 139 Sn42 Bi58 138E* Sn96.5 Ag3.0 Cu0.5 217 219 Sn96.3 Ag3.7 221E* Sn95 Ag5 221 245 Sn100 232MP** Sn99.3 Cu0.7 227E* Sn95 Sb5 232 240 Sn89 Sb10.5 Cu0.5 242 262 Sn90 Sb10 243 257 Paste Features Halide-Free We offer a range of halide-free solder pastes that meet environmental trends and regulations. Rapid Reflow Our rapid reflow solder pastes will not spatter when heated and melted by solder, iron, induction, laser, hot bar, and other rapid reflow devices. Pin Transfer and Dipping Solder pastes that are applied by dipping a component or pin into the paste. Low Residue The quantity of flux residue left after reflow is less than with typical solder pastes. Difficult-to-Solder Surfaces Solder paste for difficult-to-wet metals such as Alloy42 lead finishes and highly oxidized surfaces of aged components and boards. Gap Filling and / or Vertical Surfaces The flux is designed to hold the alloy in place until liquidus is reached. These formulas are suited to bridging gaps, filling holes, and soldering joints on vertical surfaces. *Eutectic — Solidus and Liquidus are equal **MP — Melting point *Eutectic — Solidus and Liquidus are equal **MP — Melting point
RkJQdWJsaXNoZXIy MzM3Mjk3MQ==