115 www.nordsonefd.com info@nordsonefd.com USA & Canada 800-556-3484 Europe 00800 7001 7001 Asia +86 (21) 3866 9006 Solder Solutions Solder Products SolderPlus Solder Paste SolderPlus® dispense pastes are used where solder joints are needed but printing is not possible, and solder wire is neither practical nor efficient. SolderPlus dispensing paste formulations are engineered to meet your specific alloy, flux, and special project needs. This is how Nordson EFD delivers consistent solder paste performance. • Available in no clean, RMA, RA, and water-soluble formulations • Clog-free, top-to-bottom dispensing of the entire barrel • Consistent deposit size • Packaged in EFD’s syringe barrels for best dispensing performance • No missed deposits • Reliable batch-to-batch consistency SolderPlus’s printable solder pastes are formulated for application on printed circuit boards through stencils. The dependable performance and wide process windows helps reduce manufacturing costs by increasing first-pass yields and reducing defects, rework, and rejects. Printable solder pastes are available in a wide range of lead-free and leaded alloys and particle sizes, as well as many flux formulations, including no clean, RMA, and water soluble with halogen- and halidefree options. • Long stencil life • Consistent part quality with good print definition • Reliable batch-to-batch consistency TOP SOLDERPLUS SOLUTIONS Product Name Product Description NC 21 NC 21 is optimized for dispensing applications. It is available in dispensing solder paste and printing solder paste options with all advertised alloy options. It is also available as paste flux. NC 23 NC 23 is optimized for printing with 24-hour print life. It is available with all advertised alloy options. RA 41 RA 41 is a general-purpose RA formulation. It is available in dispensing solder paste and printing solder paste options with all advertised alloy options. It is also available as paste flux. RMA 03 RMA 03 is optimized for printing with 24-hour print life. It is available with all advertised alloy options. RMA 04 RMA 04 is optimized for dispensing applications. It is available in dispensing solder paste and printing solder paste options, with all advertised alloy options. It is also available as paste flux. WS 67 WS 67 is a general purpose WS formulation. It is available in dispensing solder paste and printing solder paste options with all advertised alloy options. It is also available as paste flux. WS 70 WS 70 is optimized for printing with 24-hour print life. It is available with all advertised alloy options. WS 71 WS 71 is optimized for dispensing applications. It is formulated for high activity for soldering to stainless steel and many industrial applications. www.nordsonefd.com/SolderVideo
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